Event Update: Packaging Solutions at PACK EXPO

  • PACK EXPO 2013

    LasX Industries invites you to visit booth C4438 at PACK EXPO 2013, September 23-25 in Las Vegas, NV. Learn more about how precision laser processing can help you give your customers the easy-open and breathable convenience features they demand. Plus, learn about exciting new laser processing equipment for folding carton and label converting. Don’t wait, register now – you won’t want to miss the year’s biggest packaging event.

    Roll-Fed Laser Cutting System

    LIVE Laser Processing

    Visit Colordyne Technology’s booth S7370 to see live demonstrations of the CDT-1600 PC Laser Pro, powered by LasX’s LaserSharp® technology. This integrated digital printing and laser cutting system will feature both label and folding carton production throughout the show. The CDT-1600 PC Laser Pro prints and laser cuts at 160 feet/minute (32 in./sec.) at 1600 dpi print resolution. See the versatile new system everyone has been talking about in booth S7370!

    Trends & Technology

    PACK EXPO is the largest, most comprehensive processing and packaging event in the world. This year’s show will bring together over 26,000 packaging and processing professionals and more than 1,700 exhibitors. Explore cutting-edge technologies and network with other professionals at this premier event.

    See a preview of the CDT-1600 PC Laser Pro:

     

    Headed to PACK EXPO this year? We’d love to know – which new packaging innovations are you most excited to explore? 

     

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